Booking and Usage Charges
| S.No | Facility Name | Tools Name | Company/Model | Usage | Cost[INR] | Cost Per Hour, Or Sample, Or Process | Remark | Booking |
|---|---|---|---|---|---|---|---|---|
| 1 | Deposition Tools | E-Beam Evaporation | Excel Instruments | Deposition of Metal and Oxide Materials | 400 | Process | 400 INR up to 70nm 800 INR from 70–150nm |
Click Here |
| Thermal Evaporation | Excel Instruments | Deposition of Metal and Oxide Materials | 300 | Process | 300 INR up to 70nm 600 INR from 70–150nm |
Click Here | ||
| RF - Sputtering | Excel Instruments | Deposition of Metal and Oxide Materials | 500 | Process | 500 INR up to 70nm 1000 INR from 70–150nm |
Click Here | ||
| Horizontal Three Stack Furnace System | SVCS Process Innovation | Dry/Wet oxidation, p/n type doping | Click Here | |||||
| Spin Coater | NAVSON Model: NT12000V1 |
Photoresist coating, thin film development | 50 | Sample | Except Lithography chemicals | Click Here | ||
| 2 | Lithography Tools | Double-Side Mask Aligner System | Optical Associates Inc Model: OAI 806 EBA 500W NUV |
Mask patterning | 400 | Sample | Max. slot time per sample 30 min | |
| Direct Writing Maskless Lithography System | Durham Magneto Optics Ltd Model: MICRO WRITER ML3 PRO |
Mask patterning | 500 | Sample | Max. slot time per sample 30 min | Click Here | ||
| Oven | M/K Scientific Instruments Model: MKSI-10SC |
Drying and Annealing | 100 | 2 Hrs | Max. process time 12 Hrs | Click Here | ||
| Hot Plate | ||||||||
| Fume Hoods | ||||||||
| 3 | Packaging Tools | Semi-Automatic Wire Bonder | HYBOND Model: HYBOND 626 |
Wire bonding (Ball bonding, Wedge bonding) | 400–800 | 8 Bonds/Sample | 400 INR/Al 800 INR/Au |
|
| Wafer Dicing Tool | Disco Corporation Japan Model: DAD323 |
Dicing wafers (2", 4") | 1000 | Wafer | Click Here | |||
| 4 | Material Characterization | FESEM With E-Beam Lithography System | M/S FEI Company of the USA Model: APREO 2 S HiVac |
Surface characterization and patterning | 200 | Sample | 5 images/sample, Max. 2 hrs/slot | Click Here |
| Stylus-Based Profiler | Bruker Singapore Pvt. Ltd. Model: DEKTAK –XT |
Thin film depth characterization | 100 | Sample | Max. slot time 30 min | Click Here | ||
| Microscope | ||||||||
| 5 | Electrical Characterization | Parameter Analyzer (4200A) | M/S Tektronix Asia Ltd Model: Keithley 4200A-SCS |
Electrical Characterization | 100 | Hrs | Max. slot time 3 hrs | Click Here |
| Wafer Probe Station | M/S Formfactor Inc Model: EPS 150 FA |
Probe station for electrical characterization | Click Here |
