Usage Charges
| S.NO | Facility Name | Company/Model | Usage | Cost[INR] | Cost per Hour | Remark |
|---|---|---|---|---|---|---|
| 01 | E-Beam Evaporation | Excel Instruments | Deposition of Metal and Oxide materials | 400 | Slot | 400 INR up to 70nm 800 INR from 70–150nm |
| 02 | Thermal Evaporation | Excel Instruments | Deposition of Metal and Oxide materials | 300 | Slot | 300 INR up to 70nm 600 INR from 70–150nm |
| 03 | RF - Sputtering | Excel Instruments | Deposition of Metal and Oxide materials | 500 | Slot | 500 INR up to 70nm 1000 INR from 70–150nm |
| 04 | Parameter Analyzer (4200A) | M/S Tektronix Asia Ltd Model: Keithley 4200A-SCS |
Electrical Characterization | 100 | Hrs | Max. slot time 3 hrs |
| Wafer Probe for Device Characterization | M/S Formfactor Inc Model: EPS 150 FA |
Probe station for electrical characterization | ||||
| 05 | FESEM | M/S FEI Company of USA Model: APREO 2 S HiVac |
Surface characterization and patterning | 200 | Sample | 5 images/sample, Max. 2 hrs/slot |
| 06 | E-Beam Lithography System | RAITH | Mask patterning | 500 | Sample | Max. slot time per sample 30 min |
| 07 | Direct Writing Maskless Lithography | Durham Magneto Optics Ltd Model: MICRO WRITER ML3 PRO |
Mask patterning | 500 | Sample | Max. slot time per sample 30 min |
| 08 | Double-Side Mask Aligner System | Optical Associates Inc Model: OAI 806 EBA 500W NUV |
Mask patterning | 400 | Sample | Max. slot time per sample 30 min |
| 09 | Wafer Dicing Tool | Disco Corporation Japan Model: DAD323 |
Dicing wafers (2", 4") | 1000 | Wafer | |
| 10 | Stylus Based Profiler | Bruker Singapore Pvt. Ltd. Model: DEKTAK –XT |
Thin film depth characterization | 100 | Sample | Max. slot time 30 min |
| 11 | Semi-Automatic Wire Bonder | HYBOND Model: HYBOND 626 |
Wire bonding (Ball bonding, Wedge bonding) | 400–800 | 8 Bonds/Sample | 400 INR/Al 800 INR/Au |
| 12 | Horizontal Three Stack Furnace System | SVCS Process Innovation | Dry/Wet oxidation, p/n type doping | |||
| 13 | Vacuum Oven | M/K Scientific Instruments Model: MKSI-10SC |
Drying and Annealing | 100 | 2 Hrs | Max. process time 12 Hrs |
| 14 | Spin Coater | NAVSON Model: NT12000V1 |
Photoresist coating, thin film development | 50 | Sample | Except Lithography chemicals |
| 15 | Chemical Benches | Nano-Clean | Wafer cleaning, chemical reactions, hydrothermal growth | 100 | Process | Max. slot time 2 hrs |
