Specifications

• Filament: Tungsten
• Secondary e-image resolution: 3 nm 30 Kv (Standard Sample)
• Tilt: -10 to + 90 Degree
• EHT: 30kV
• Magnification: Up to 50K ~ 100K (Depends on sample)
• Process Capabilities: Imaging Modes: Surface & Cross-Sectional,
• Sample Holder: Maximum 9 stubs (~1 CM Dia.) can be mounted
• EDX
• Elemental Mapping

Application:

• SEM analyzes surface morphology and microstructures of metals, ceramics, and composites.
• It helps find out the particle size in nanomaterials.
• Corrosion Evaluation
• Film Topography Measurement
• Striation measurement for high-cycle fatigue fractures.
• Surface contamination analysis.
• Surface contamination analysis
• Laser & weld evaluation.
• Printed and integrated circuit analysis.
• EDX determines the elemental composition and distribution in metals and alloys to assess quality and uniformity.
• This also identifies contaminants or material inconsistencies in microchips and circuit boards

Sample should be dry and conducting . In case of Non conducting samples metal coating is rquired

Content will be updated soon..

Name: Dr Jayita Sarkar

Designation: Snr Scientific Officer

Phone:0291 280 1343

Email:jsarkar[at]iitj[dot]ac[dot]in

Name: Dr Saloni Sharma

Designation: Scientific Officer

Phone:0291 280 1347

Email:saloni[at]iitj[dot]ac[dot]in

Name: Mr lalit Mohan

Designation: Junior Assistant

Phone:0291 280 1344

Email: