Dr. Jai Narayan Tripathi received the Ph.D. degree in electrical engineering from Indian Institute of Technology Bombay, Mumbai, India, in 2014. He is currently an Associate Professor at Indian Institute of Technology Jodhpur, Rajasthan, India; Visiting Professor at Politecnico Di Torino, Italy, as well as an Adjunct Research Professor at Carleton University, Ottawa, Canada. In past, he has worked with STMicroelectronics, India, for almost 7 years where he was involved in the design issues of various high-speed Systems-on-Chip (SoCs). He was a Visiting Scientist with the Politecnico di Torino, Turin, Italy, in 2016 and 2017, where he was also a Visiting Postdoctoral Fellow, in 2016. His current research interests include signal integrity, power integrity, electromagnetic interference/electromagnetic compatibility, metaheuristic optimization, and RF circuits. He has authored or coauthored over 100 research papers in refereed journals, as book chapters and in the proceedings of top international conferences. His papers have won best paper awards in a couple of inter-national conferences. His current research interests include signal integrity, power integrity, electromagnetic interference/electromagnetic compatibility, metaheuristic optimization, and RF circuits. Dr. Tripathi has received a couple of sponsored research grants as well as SIRE Fellowship from Science and Engineering Research Board (SERB), Govt. of India.

Dr. Tripathi has served as a TPC Member for over 30 international conferences including the premier conferences such as IEEE EPEPS, IEEE SPI, VLSI Design, IEEE EDAPS, VDAT, etc. He was a recipient of the Young Investigator Training Program Research Award by Associazione Di Fondazioni E Di Casse Di Risparmio Spa (ACRI), Italy, in 2016 and 2017, consecutively. He was an Invited Speaker in IEEE EDAPS 2015, Seoul, South Korea, where he also served as a Session Co-Chair for the session High-Speed Channels and Interconnects. He has served as a TPC Co-Chair for IEEE EDAPS 2018 and will be serving for the same position in IEEE EDAPS 2024. He has been a Session Chair in several international conferences including the flagship conferences such as IEEE ICECS, IEEE EDAPS, IEEE CAFE, etc. He has delivered invited talks at various universities in India and abroad. He has served as a reviewer for many international journals, such as IEEE TCAS-I: Regular Papers, IEEE TCAS-II: Express Briefs, IEEE TVLSI, IEEE TEMC, IEEE TPES, PIER, Microelectronics Journal, etc. He has delivered invited talks at various universities and international forums. He is a member of a technical committee TC-12 EDMS of IEEE EPS Society. Dr. Tripathi was a member of the ‘Best Paper Award Committee’ of IEEE EDAPS 2020. Dr. Tripathi is currently working as an Associate Editor for IEEE Transactions on Signal and Power Integrity, IEEE Transactions on Components, Packaging and Manufacturing Technology and IEEE Electromagnetic Compatibility Magazine. In past, he has also served as an Associate Editor for IEEE Open Journal of Circuits and Systems. He is a Senior Member of IEEE.